X12DPD-A6M25 (For SuperServer Only)
For Pricing, Contact Us
X12DPG-AR (For SuperServer Only)
For Pricing, Contact Us
X12DPFR-AN6
Key Features
-
- 3rd Gen Intel® Xeon® Scalable processors
- Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 165W TDP, 3 UPI up to 10.4 GT/s
- Intel® C621A
-
- Up to 2TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz
- Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz, in 16 DIMM slots
-
- 1 PCIe 4.0 x16 Right Riser Slot,
- 1 PCIe 4.0 x8 connector for SMC add-on cards,
- 3 PCIe 4.0 NVMe x8 Internal Port(s)
- 1 PCIe 4.0 x16, OCP 3.0 compliant
- Intel® C621A controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
- 1 VGA port
-
- Single LAN with
- Networking options provided via AIOM module
For Pricing, Contact Us
Related products
Hyper SuperServer SYS-121H-TNR (Complete System)
For Pricing, Contact Us
Key Applications
- Virtualization
- Software-defined Storage
- AI Inference and Machine Learning
- Cloud Computing
- Enterprise Server
Key Features
- Dual Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processors
- 32 DIMM slots supporting up to 8TB of memory; RDIMMs up to DDR5-5600
- 3 PCIe 5.0 x16 slots with support for GPU/Accelerator cards
- Flexible networking options with 1 AIOM networking slot (OCP NIC 3.0 compatible)
-
- 8x 2.5" hot-swap NVMe/SATA/SAS drive bays;
- Optional 4x 2.5" hot-swap NVMe/SAS/SATA drive bays;
- 2x internal M.2 NVMe/SATA drive slots;
- Optional RAID support via storage add-on card
- 8 heavy duty hot-swap fans with optimal fan speed control
X11SPH-nCTPF
For Pricing, Contact Us
Key Features
- 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Single Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 205W TDP
- Intel® C622 chipset
- Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
-
- Expansion slots:
- 1 PCIe 3.0 x16 (x16 || x8),
- 1 PCIe 3.0 x8 (x0 || x8),
- 1 PCIe 3.0 x8,
- 1 PCIe 3.0 x4 (in x8)
- 2x Port NVMe PCIe 3.0 x4 via OCuLink
-
- M.2 NGFF connector
- M.2 Interface: PCIe 3.0 x4 and SATA
- Form Factor: 2280
- Key: M-Key
- 8 SAS3 (12Gbps) via Broadcom® 3008; RAID 0, 1, 10
- 10 SATA3 (6Gbps) via C622
- 2 10G SFP+
- 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2 rear, 6 via headers)
X11SPL-F
For Pricing, Contact Us
Key Features
- 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Single Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 165W TDP
- Intel® C621 Chipset
-
- Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;
- Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
-
- Expansion slots:
- 2 PCIe 3.0 x8 (in x16),
- 4 PCIe 3.0 x8,
- 1 PCIe 3.0 x4 (in x8)
-
- M.2 NGFF connector
- M.2 Interface: PCIe 3.0 x4 and SATA
- Form Factor: 2280, 22110
- Key: M-Key
- 2 GbE LAN ports
- 8 SATA3 (6Gbps) ports
- I/O: 1 VGA, 2 COM, TPM header
- 2 SuperDOM with built-in power
- 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2 rear, 6 via headers)
X11SPM-F
For Pricing, Contact Us
Key Features
- 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 165W TDP
- Intel® C621 Chipset
-
- Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots;
- Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
- Expansion slots: 2 PCIe 3.0 x16, 1 PCIe 3.0 x8 (in x8)
-
- M.2 NGFF connector
- M.2 Interface: PCIe 3.0 x4
- Form Factor: 2242, 2280
- Key: M-Key
- 2 GbE LAN ports
- 12 SATA3 (6Gbps) via C621
- Supports 12V DC power input
- 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)
- I/O: 1 VGA, 2 COM, TPM header
X11SRM-VF
For Pricing, Contact Us
Key Features
- Intel® Xeon® W-2100 Processors, Intel® Xeon® W-2200 Processors, Single Socket LGA-2066 (Socket R4) supported, CPU TDP supports Up to 165W TDP
- Intel® C422
- Intel® VROC
- Up to 256GB ECC RDIMM, DDR4-2933MHz; Up to 512GB ECC LRDIMM, DDR4-2933MHz, in 4 DIMM slots
- 1 PCIe 3.0 x16, 2 PCIe 3.0 x8, 4 PCIe 3.0 NVMe x4 Internal Port(s) M.2 Interface: 1 PCIe 3.0 x4 M.2 Form Factor: 2280 M.2 Key: M-Key Double Height Connector
- Dual LAN with Intel® i210 Gigabit Ethernet Controller
| Dimensions | 19.58 × 42.27 cm |
|---|---|
| Dimension |
8.53" x 19.66" (21.59cm x 48.26cm) |