X11SPI-TF
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X11SPM-F
X11SPM-F For Pricing, Contact Us

X11SPL-F

Key Features

  1. 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Single Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 165W TDP
  2. Intel® C621 Chipset
    • Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;
    • Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
    • Expansion slots:
    • 2 PCIe 3.0 x8 (in x16),
    • 4 PCIe 3.0 x8,
    • 1 PCIe 3.0 x4 (in x8)
    • M.2 NGFF connector
    • M.2 Interface: PCIe 3.0 x4 and SATA
    • Form Factor: 2280, 22110
    • Key: M-Key
  3. 2 GbE LAN ports
  4. 8 SATA3 (6Gbps) ports
  5. I/O: 1 VGA, 2 COM, TPM header
  6. 2 SuperDOM with built-in power
  7. 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2 rear, 6 via headers)

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3 Years Warranty

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Dimensions 19.58 × 42.27 cm
Dimension

12" x 9.6" (30.48cm x 24.38cm)