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X11SPL-F
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Key Features
- 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Single Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 165W TDP
- Intel® C621 Chipset
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- Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;
- Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
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- Expansion slots:
- 2 PCIe 3.0 x8 (in x16),
- 4 PCIe 3.0 x8,
- 1 PCIe 3.0 x4 (in x8)
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- M.2 NGFF connector
- M.2 Interface: PCIe 3.0 x4 and SATA
- Form Factor: 2280, 22110
- Key: M-Key
- 2 GbE LAN ports
- 8 SATA3 (6Gbps) ports
- I/O: 1 VGA, 2 COM, TPM header
- 2 SuperDOM with built-in power
- 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2 rear, 6 via headers)
