Hyper SuperServer SYS-121H-TNR (Complete System)
For Pricing, Contact UsKey Applications
- Virtualization
- Software-defined Storage
- AI Inference and Machine Learning
- Cloud Computing
- Enterprise Server
Key Features
- Dual Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processors
- 32 DIMM slots supporting up to 8TB of memory; RDIMMs up to DDR5-5600
- 3 PCIe 5.0 x16 slots with support for GPU/Accelerator cards
- Flexible networking options with 1 AIOM networking slot (OCP NIC 3.0 compatible)
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- 8x 2.5″ hot-swap NVMe/SATA/SAS drive bays;
- Optional 4x 2.5″ hot-swap NVMe/SAS/SATA drive bays;
- 2x internal M.2 NVMe/SATA drive slots;
- Optional RAID support via storage add-on card
- 8 heavy duty hot-swap fans with optimal fan speed control
IT Infrastructure Consultation Services
For Pricing, Contact UsOur IT infrastructure consultants, attuned to the unique needs and objectives of your organization, are ready to assist you in optimizing and enhancing your information technology infrastructure. Choose us for a seamless blend of expertise and innovation in IT infrastructure consultation.
X11SPG-TF
For Pricing, Contact UsKey Features
- 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP
- Intel® C621 Chipset
- Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots
- 3 PCIe 3.0 x16
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- 2x M.2 NGFF connectors
- M.2 Interface: PCIe 3.0 x4
- Form Factor: 2280
- Key: M-Key
- 2 10GbE LAN ports
- 6 SATA (6Gbps)
- 2 SuperDOM with built-in power
- I/O: 1 VGA, 1 COM, TPM header
- 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 4 USB 2.0 (2 rear, 2 via headers)
X11SPH-nCTF
For Pricing, Contact UsKey Features
- 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP
- Intel® C622 chipset
- Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
-
- Expansion slots:
- 1 PCIe 3.0 x16 (x16 || x8),
- 1 PCIe 3.0 x8 (x0 || x8),
- 1 PCIe 3.0 x8,
- 1 PCIe 3.0 x4 (in x8)
- 2x Port NVMe PCIe 3.0 x4 via OCuLink
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- M.2 NGFF connector
- M.2 Interface: PCIe 3.0 x4 and SATA
- Form Factor: 2280
- Key: M-Key
- 8 SAS3 (12Gbps) via Broadcom® 3008; RAID 0, 1, 10
- 2 10GbE LAN ports
- 10 SATA3 (6Gbps) via C622
- 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2 rear, 6 via headers)
X11SPH-nCTPF
For Pricing, Contact UsKey Features
- 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Single Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 205W TDP
- Intel® C622 chipset
- Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
-
- Expansion slots:
- 1 PCIe 3.0 x16 (x16 || x8),
- 1 PCIe 3.0 x8 (x0 || x8),
- 1 PCIe 3.0 x8,
- 1 PCIe 3.0 x4 (in x8)
- 2x Port NVMe PCIe 3.0 x4 via OCuLink
-
- M.2 NGFF connector
- M.2 Interface: PCIe 3.0 x4 and SATA
- Form Factor: 2280
- Key: M-Key
- 8 SAS3 (12Gbps) via Broadcom® 3008; RAID 0, 1, 10
- 10 SATA3 (6Gbps) via C622
- 2 10G SFP+
- 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2 rear, 6 via headers)
X11SPI-TF
For Pricing, Contact UsKey Features
- 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP
- Intel® C622
- Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
-
- Expansion slots:
- 1 PCIe 3.0 x16,
- 1 PCIe 3.0 x16 (x16 || x8),
- 1 PCIe 3.0 x8 (x0 || x8),
- 1 PCIe 3.0 x8,
- 1 PCIe 3.0 x4 (in x8)
-
- M.2 NGFF connector
- M.2 Interface: PCIe 3.0 x4 and SATA
- Form Factor: 2280, 22110
- Key: M-Key
- 2 10GbE LAN ports
- 10 SATA3 (6Gbps) via C622
- 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)
- I/O: 1 VGA, 2 COM, TPM header
X11SPL-F
For Pricing, Contact UsKey Features
- 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Single Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 165W TDP
- Intel® C621 Chipset
-
- Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;
- Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
-
- Expansion slots:
- 2 PCIe 3.0 x8 (in x16),
- 4 PCIe 3.0 x8,
- 1 PCIe 3.0 x4 (in x8)
-
- M.2 NGFF connector
- M.2 Interface: PCIe 3.0 x4 and SATA
- Form Factor: 2280, 22110
- Key: M-Key
- 2 GbE LAN ports
- 8 SATA3 (6Gbps) ports
- I/O: 1 VGA, 2 COM, TPM header
- 2 SuperDOM with built-in power
- 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2 rear, 6 via headers)
X11SPM-F
For Pricing, Contact UsKey Features
- 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 165W TDP
- Intel® C621 Chipset
-
- Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots;
- Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
- Expansion slots: 2 PCIe 3.0 x16, 1 PCIe 3.0 x8 (in x8)
-
- M.2 NGFF connector
- M.2 Interface: PCIe 3.0 x4
- Form Factor: 2242, 2280
- Key: M-Key
- 2 GbE LAN ports
- 12 SATA3 (6Gbps) via C621
- Supports 12V DC power input
- 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)
- I/O: 1 VGA, 2 COM, TPM header
X11SPM-TF
For Pricing, Contact UsKey Features
- 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 165W TDP
- Intel® C622 chipset
-
- Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots;
- Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
- Expansion slots: 2 PCIe 3.0 x16, 1 PCIe 3.0 x8 (in x8)
-
- M.2 NGFF connector
- M.2 Interface: PCIe 3.0 x4
- Form Factor: 2242, 2280
- Key: M-Key
- 2 10GbE LAN ports
- 12 SATA3 (6Gbps) via C622
- Supports 12V DC power input
- 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)
- I/O: 1 VGA, 2 COM, TPM header
X11SPM-TPF
For Pricing, Contact UsKey Features
- 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 165W TDP
- Intel® C622 chipset
-
- Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots;
- Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
- Expansion slots: 2 PCIe 3.0 x16, 1 PCIe 3.0 x8 (in x8)
-
- M.2 NGFF connector
- M.2 Interface: PCIe 3.0 x4
- Form Factor: 2242, 2280
- Key: M-Key
- 2 10G SFP+
- 12 SATA3 (6Gbps) via C622
- Supports 12V DC power input
- 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)
- I/O: 1 VGA, 2 COM, 1 TPM header
X11SPW-CTF
For Pricing, Contact UsKey Features
- 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP
- Intel® C622 chipset
- Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots
-
- Expansion slots:
- 1 PCIe 3.0 x8 (in x16), 1 PCIe 3.0 x32 Left Riser slot
-
- M.2 NGFF connector
- M.2 Interface: PCIe 3.0 x4 and SATA
- Form Factor: 2280, 22110
- Key: M-Key
- 2 10GbE LAN ports
- 10 SATA3 (6Gbps) via C622
- 4 SAS3 (12Gbps) via Broadcom® 3008; RAID 0, 1, 10
- I/O: 1 VGA, 2 COM, TPM header
- 2 SuperDOM with built-in power
X11SPW-TF
For Pricing, Contact UsKey Features
- 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP
- Intel® C622 chipset
- Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots
-
- Expansion slots:
- 1 PCIe 3.0 x8 (in x16), 1 PCIe 3.0 x32 Left Riser slot
-
- M.2 NGFF connector
- M.2 Interface: PCIe 3.0 x4 and SATA
- Form Factor: 2280, 22110
- Key: M-Key
- 2 10GbE LAN ports
- 10 SATA3 (6Gbps) via C622
- I/O: 1 VGA, 2 COM, TPM header
- 2 SuperDOM with built-in power