Hyper SuperServer SYS-121H-TNR (Complete System)
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Key Applications
- Virtualization
- Software-defined Storage
- AI Inference and Machine Learning
- Cloud Computing
- Enterprise Server
Key Features
- Dual Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processors
- 32 DIMM slots supporting up to 8TB of memory; RDIMMs up to DDR5-5600
- 3 PCIe 5.0 x16 slots with support for GPU/Accelerator cards
- Flexible networking options with 1 AIOM networking slot (OCP NIC 3.0 compatible)
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- 8x 2.5" hot-swap NVMe/SATA/SAS drive bays;
- Optional 4x 2.5" hot-swap NVMe/SAS/SATA drive bays;
- 2x internal M.2 NVMe/SATA drive slots;
- Optional RAID support via storage add-on card
- 8 heavy duty hot-swap fans with optimal fan speed control
IT Infrastructure Consultation Services
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X11SPG-TF
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Key Features
- 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP
- Intel® C621 Chipset
- Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots
- 3 PCIe 3.0 x16
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- 2x M.2 NGFF connectors
- M.2 Interface: PCIe 3.0 x4
- Form Factor: 2280
- Key: M-Key
- 2 10GbE LAN ports
- 6 SATA (6Gbps)
- 2 SuperDOM with built-in power
- I/O: 1 VGA, 1 COM, TPM header
- 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 4 USB 2.0 (2 rear, 2 via headers)
X11SPH-nCTF
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Key Features
- 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP
- Intel® C622 chipset
- Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
-
- Expansion slots:
- 1 PCIe 3.0 x16 (x16 || x8),
- 1 PCIe 3.0 x8 (x0 || x8),
- 1 PCIe 3.0 x8,
- 1 PCIe 3.0 x4 (in x8)
- 2x Port NVMe PCIe 3.0 x4 via OCuLink
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- M.2 NGFF connector
- M.2 Interface: PCIe 3.0 x4 and SATA
- Form Factor: 2280
- Key: M-Key
- 8 SAS3 (12Gbps) via Broadcom® 3008; RAID 0, 1, 10
- 2 10GbE LAN ports
- 10 SATA3 (6Gbps) via C622
- 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2 rear, 6 via headers)
X11SPH-nCTPF
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Key Features
- 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Single Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 205W TDP
- Intel® C622 chipset
- Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
-
- Expansion slots:
- 1 PCIe 3.0 x16 (x16 || x8),
- 1 PCIe 3.0 x8 (x0 || x8),
- 1 PCIe 3.0 x8,
- 1 PCIe 3.0 x4 (in x8)
- 2x Port NVMe PCIe 3.0 x4 via OCuLink
-
- M.2 NGFF connector
- M.2 Interface: PCIe 3.0 x4 and SATA
- Form Factor: 2280
- Key: M-Key
- 8 SAS3 (12Gbps) via Broadcom® 3008; RAID 0, 1, 10
- 10 SATA3 (6Gbps) via C622
- 2 10G SFP+
- 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2 rear, 6 via headers)
X11SPI-TF
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Key Features
- 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP
- Intel® C622
- Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
-
- Expansion slots:
- 1 PCIe 3.0 x16,
- 1 PCIe 3.0 x16 (x16 || x8),
- 1 PCIe 3.0 x8 (x0 || x8),
- 1 PCIe 3.0 x8,
- 1 PCIe 3.0 x4 (in x8)
-
- M.2 NGFF connector
- M.2 Interface: PCIe 3.0 x4 and SATA
- Form Factor: 2280, 22110
- Key: M-Key
- 2 10GbE LAN ports
- 10 SATA3 (6Gbps) via C622
- 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)
- I/O: 1 VGA, 2 COM, TPM header
X11SPL-F
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Key Features
- 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Single Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 165W TDP
- Intel® C621 Chipset
-
- Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;
- Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
-
- Expansion slots:
- 2 PCIe 3.0 x8 (in x16),
- 4 PCIe 3.0 x8,
- 1 PCIe 3.0 x4 (in x8)
-
- M.2 NGFF connector
- M.2 Interface: PCIe 3.0 x4 and SATA
- Form Factor: 2280, 22110
- Key: M-Key
- 2 GbE LAN ports
- 8 SATA3 (6Gbps) ports
- I/O: 1 VGA, 2 COM, TPM header
- 2 SuperDOM with built-in power
- 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2 rear, 6 via headers)
X11SPM-F
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Key Features
- 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 165W TDP
- Intel® C621 Chipset
-
- Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots;
- Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
- Expansion slots: 2 PCIe 3.0 x16, 1 PCIe 3.0 x8 (in x8)
-
- M.2 NGFF connector
- M.2 Interface: PCIe 3.0 x4
- Form Factor: 2242, 2280
- Key: M-Key
- 2 GbE LAN ports
- 12 SATA3 (6Gbps) via C621
- Supports 12V DC power input
- 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)
- I/O: 1 VGA, 2 COM, TPM header
X11SPM-TF
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Key Features
- 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 165W TDP
- Intel® C622 chipset
-
- Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots;
- Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
- Expansion slots: 2 PCIe 3.0 x16, 1 PCIe 3.0 x8 (in x8)
-
- M.2 NGFF connector
- M.2 Interface: PCIe 3.0 x4
- Form Factor: 2242, 2280
- Key: M-Key
- 2 10GbE LAN ports
- 12 SATA3 (6Gbps) via C622
- Supports 12V DC power input
- 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)
- I/O: 1 VGA, 2 COM, TPM header
X11SPM-TPF
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Key Features
- 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 165W TDP
- Intel® C622 chipset
-
- Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots;
- Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
- Expansion slots: 2 PCIe 3.0 x16, 1 PCIe 3.0 x8 (in x8)
-
- M.2 NGFF connector
- M.2 Interface: PCIe 3.0 x4
- Form Factor: 2242, 2280
- Key: M-Key
- 2 10G SFP+
- 12 SATA3 (6Gbps) via C622
- Supports 12V DC power input
- 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)
- I/O: 1 VGA, 2 COM, 1 TPM header
X11SPW-CTF
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Key Features
- 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP
- Intel® C622 chipset
- Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots
-
- Expansion slots:
- 1 PCIe 3.0 x8 (in x16), 1 PCIe 3.0 x32 Left Riser slot
-
- M.2 NGFF connector
- M.2 Interface: PCIe 3.0 x4 and SATA
- Form Factor: 2280, 22110
- Key: M-Key
- 2 10GbE LAN ports
- 10 SATA3 (6Gbps) via C622
- 4 SAS3 (12Gbps) via Broadcom® 3008; RAID 0, 1, 10
- I/O: 1 VGA, 2 COM, TPM header
- 2 SuperDOM with built-in power
X11SPW-TF
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Key Features
- 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP
- Intel® C622 chipset
- Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots
-
- Expansion slots:
- 1 PCIe 3.0 x8 (in x16), 1 PCIe 3.0 x32 Left Riser slot
-
- M.2 NGFF connector
- M.2 Interface: PCIe 3.0 x4 and SATA
- Form Factor: 2280, 22110
- Key: M-Key
- 2 10GbE LAN ports
- 10 SATA3 (6Gbps) via C622
- I/O: 1 VGA, 2 COM, TPM header
- 2 SuperDOM with built-in power