Key Features

1. 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP
2. Intel® C622
3. Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
4. • Expansion slots:
   • 1 PCIe 3.0 x16,
   • 1 PCIe 3.0 x16 (x16 || x8),
   • 1 PCIe 3.0 x8 (x0 || x8),
   • 1 PCIe 3.0 x8,
   • 1 PCIe 3.0 x4 (in x8)
5. • M.2 NGFF connector
   • M.2 Interface: PCIe 3.0 x4 and SATA
   • Form Factor: 2280, 22110
   • Key: M-Key
6. 2 10GbE LAN ports
7. 10 SATA3 (6Gbps) via C622
8. 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)
9. I/O: 1 VGA, 2 COM, TPM header