Key Features

1. 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Single Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 205W TDP
2. Intel® C622 chipset
3. Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
4. • Expansion slots:
   • 1 PCIe 3.0 x16 (x16 || x8),
   • 1 PCIe 3.0 x8 (x0 || x8),
   • 1 PCIe 3.0 x8,
   • 1 PCIe 3.0 x4 (in x8)
5. 2x Port NVMe PCIe 3.0 x4 via OCuLink
6. • M.2 NGFF connector
   • M.2 Interface: PCIe 3.0 x4 and SATA
   • Form Factor: 2280
   • Key: M-Key
7. 8 SAS3 (12Gbps) via Broadcom® 3008; RAID 0, 1, 10
8. 10 SATA3 (6Gbps) via C622
9. 2 10G SFP+
10. 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2 rear, 6 via headers)