X11SPM-F
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X11SPM-TPF
X11SPM-TPF For Pricing, Contact Us

X11SPM-TF

Key Features

  1. 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 165W TDP
  2. Intel® C622 chipset
    • Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots;
    • Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
  3. Expansion slots: 2 PCIe 3.0 x16, 1 PCIe 3.0 x8 (in x8)
    • M.2 NGFF connector
    • M.2 Interface: PCIe 3.0 x4
    • Form Factor: 2242, 2280
    • Key: M-Key
  4. 2 10GbE LAN ports
  5. 12 SATA3 (6Gbps) via C622
  6. Supports 12V DC power input
  7. 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)
  8. I/O: 1 VGA, 2 COM, TPM header

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3 Years Warranty

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Dimensions 19.58 × 42.27 cm
Dimension

9.6" x 9.6" (24.38cm x 24.38cm)